Chassis refers to the outer shell of electronic products, the materials are polycarbonate PC, ABS engineering plastics, etc.
PC-GF-## (Polycarbonate PC): PC-GF-## is also a kind of material used in the shell. Its raw material is petroleum. After processing by the polyester chip factory, it becomes polyester chip particles. After being processed by a plastic factory, it becomes a finished product. From a practical point of view, its heat dissipation performance is better than ABS plastic, and the heat is more evenly distributed. Its biggest disadvantage is that it is brittle and breaks when it is dropped. Our common CD-ROM uses this. Made of materials. The most significant use of this material is FUJITSU, which is used in many models, and it is used in the entire shell. No matter from the surface or from the touch, the PC-GF-## material feels like metal. If there is no logo on the inside, you ca n’t look at it from the outer surface, and you may think it is an alloy.
ABS engineering plastic: ABS engineering plastic is PC + ABS (engineering plastic alloy). The Chinese name in the chemical industry is plastic alloy. The reason why it is named PC + ABS is that this material has the excellent heat resistance and weather resistance of PC resin. , Dimensional stability and impact resistance, and has excellent processing fluidity of ABS resin. Therefore, it can be used in thin-walled and complex-shaped products to maintain its excellent performance and maintain the moldability of plastic and an ester-containing material. The most disadvantages of ABS engineering plastics are heavy weight and poor thermal conductivity. Generally speaking, ABS engineering plastics are used by most manufacturers due to their low cost. At present, most plastic casings are made of ABS engineering plastics.
Electronic & Instrument Enclosures is widely used in instruments, meters, electronics, communications, automation, sensors, smart cards, industrial control, precision machinery and other industries. It is an ideal box for high-end instruments.